Silicon Photonics TD Process Integration Engineer NM SPDM
As a Silicon Photonics (SiP) Process Integration Engineer, you will be part of Intel's SiP Process Development and Manufacturing (SPDM) team that is leading Intel's market transition and driving innovation for the next generation of optical interconnect products. You will play a critical role in the next generation of silicon photonics fabrication processes by improving yield/reliability, process capability and manufacturability.
The Silicon Photonics TD Process Integration Engineer will be responsible for but not limited to:
Collaborates with Yield Analysis, Device and Defect Engineers, SPPD (SiP Product Division) designers, and Process Engineers to ensure new processes and products are capable of meeting yield and reliability requirements at the time of PRQ, and setup systems that enable best balance of manufacturability and quality for Production Ramp.
Defines and establishes process flow, procedures, and required equipment to develop new devices or products. Plans and conducts experiments to fully characterize the process throughout the development cycle.
Drives improvements and solves technical problems on quality/reliability, cost, yield, process stability/capability, and productivity.
Develops solutions and solves problems utilizing formal education, experience, statistical analysis, and problem-solving methodologies / tools.
Develops strategies to resolve difficult problems and establishes systems to deal with these problems in the future.
Trains production/receiving engineers for transfer to high volume manufacturing.
The ideal candidate should exhibit the following behavioral traits:
Time management skills, self-motivated, and desire to succeed in a fast-paced and challenging environment.
Willingness to learn quickly, be resourceful and have strong problem-solving skills.
Full time onsite required during training, estimated 6 months. After training: hybrid "work from home" to be defined by manager and employee but continued onsite will be required.
Master's in engineering (Chemical, Electrical, Materials, etc.) and/or Science discipline such as Physics, Optics/Photonics.
1+ years of experience in semiconductor and/or SiP process technology.
1+ years of experience in any of the following: Optics, Photonics, SiP, Lasers, or III/V compound.
Ph.D. in Engineering (Chemical, Electrical, Materials, etc.) and/or Science discipline such as Physics, Optics/Photonics.
1+ years of experience in advanced data analysis (using JMP, GAJT and/or SQL), statistical process control (SPC), and design of experiment (DOE) principles.