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Oregon Wafer Level Assembly Bond Debond Process Engineer

Hillsboro, אורגון Job ID JR0252915 Job Category Manufacturing and Process Development Work Mode On-site Required Experience Level Entry Level
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Job Description


Bond Debond Process Engineers work in a semiconductor fab to develop and sustain manufacturing processes that prepare microprocessor die for Advanced 3D Assembly. Our toolsets use fundamental process such as spin-coating, curing, laser ablation, advanced cleaning chemistries, and plasma deposition to enable the stacking of die. The candidate will work with technicians, vendors, and support organizations to maintain and improve safety, product quality, capacity/availability, and decrease costs of the module. Will be responsible for developing procedures for operation and maintenance of the toolset, introducing/qualifying new products, and qualifying new equipment. Will perform experiments to identify and eliminate defects, improve tool health, and increase toolset capability/efficiency. Will recommend and implement modifications for operating the equipment and process flow. Will exercise independent judgement and discretion by making recommendations and adjusting tools/processes reactively when something has changed on the line or proactively in order to maximize output. will develops solutions to problems utilizing formal education and judgement. This is an entry-level position and will be compensated accordingly based on education level and experience.

Qualifications


The candidate must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and/or internship experience. Minimum Qualifications: Candidate must possess a Bachelors or Master's degree in an Engineering and/or Science discipline such as Physics, Applied Physics, Chemistry, Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or related field of study. Preferred Qualifications: 1+ years in semiconductor industry experience via graduate research, internship, or prior employment. 1+ years in statistical process control techniques, data analysis, and model-based problem solving.

Inside this Business Group


As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model


This role will require an on-site presence.
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